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  • Q Reliability Test: Longitudinal Twisting test, Bending &Winding test, Wrestling Test, Switching cycle test

    A Reliability Test for cob tape light as below
    Longitudinal Twisting test>>>Install a 1.0meter long cob led strip on the test bench, light the sample, the test torsion angle is 720 °, turn it forward 720 ° and then reverse 720 ° twice, and repeat the torsion 5000 times according requirements.
    Bending &Winding test>>>Install 1m long cob led strip on the test bench, fix both ends on the fixed base of the test equipment, and wrap the sample to the  electrostatic rod for one round, and straighten it horizontally to light up; The test speed is 180mm/min, and the continuous cycle test is 5000 times. 
    Wrestling Test>>>Install 1m long cob strip light on the test bench, the test speed is 60times/min,and the continuous cycle test >5000 times.   
    Switching cycle test>>>A steady state test of the photometric testing according to the IES LM-79 before and after the test. At normal temperature ,5 seconds on, 5 seconds off for 1 switch cycle, continuous cycle test 25000 times.  
  • Q Environmental Test: Temperature rise test, Thermal Shock test, Temperature Cycling test

    A Environmental Test for cob led strip as below
    Temperature rise test>>>Test at normal temperature, monitor the temperature of components at the front end and rear end of 1m cob led strip sample (record front-end luminous colloid surface, PCB pad surface, rear-end PCB pad surface, rear-end luminous colloid surface,ambient temperature).
    Thermal Shock test>>>A steady state test of the photometric testing according to the IES LM-79 before and after the test. Put the test cob strip sample to low temperature-40℃ for 15 minutes. and then convert the test sample to be exposed to high temperature 100℃ for a specified time of 15 minutes. withstand 200 cycles continuously.  
    Temperature Cycling test>>>A steady state test of the photometric testing according to the IES LM-79 before and after the test. Reduce the air temperature in the test equipment to the specified low temperature-40℃ at the specified rate and expose the specified time for 1 hour; then raise the air temperature in the test equipment to the specified high temperature 65℃ at the specified rate and expose the specified time for 1 hour.During the test, the product is in working condition and the specified time is 168 hours.  
  • Q Life Test: Luminous maintenance rate and Chromatically maintenance rate, Accelerate Life test

    A Life Test of cob led strip as below
    Accelerate Life test>>>A steady state test of the photometric testing according to the IES LM-79 before and after the test. Put the test sample to high temperature 65℃ ,continuous maintenance of the specified time 336 hours, the product is in working condition during the test.      
    Luminous maintenance rate and Chromatically maintenance rate>>>Test temperature 55℃,85℃ or customer specified temperature. Test time≥6000hours,measure luminous flux each 1000hurs  

  • Q Step 1 Die Expanding

    A
    The first step in COB led strip production is die expanding. A completed semiconductor wafer, containing thousands of tightly packed LED chips, is adhesively mounted onto a special UV-tape or blue tape, which is stretched and fixed onto a metal ring frame.
    This tape is then mechanically stretched (expanded). The stretching action creates precise, uniform gaps between each individual die that were previously touching each other on the wafer.
    This "expanded" setup allows the die attach equipment (e.g., a pick-and-place machine) to accurately pick up a single die at a time without colliding with or damaging adjacent ones.
  • Q Step 2 Solder Paste Preparation & Printing

    A Solder Paste Preparation>>>the solder paste (a mixture of tiny solder particles and flux) is removed from refrigerated storage (typically 2-10°C) and allowed to thaw and acclimate to room temperature for a duration of 4-8 hours, as specified by the manufacturer. Mixing (or stirring) is then performed to achieve a uniform consistency, ensuring excellent printability and preventing defects.

    Solder Paste Printers>>>A stainless steel laser-cut stencil is precisely aligned over the FPCB. Thawed and mixed solder paste is applied on the stencil. A squeegee blade moves across the stencil, forcing the paste through the apertures ( openings) and onto the pads below. 

    Solder paste printing is the industry standard for high-volume, high-density, high-quality COB LED strip manufacturing due to its speed, consistency, stability and cost-effectiveness.
  • Q Step 3 Die Bonding for COB Chips and Resistors

    A Die Bonder‘s high-precision ejector needle or a pick-and-place head picks up a single, microscopic die chip or resistor and then places it onto the predefined solder paste deposits on the FPCB with utmost accuracy. The surface tension of the solder paste temporarily holds the die in place before the reflow process.
  • Q Step 4 Reflow Soldering

    A
    The FPCB, now with the precisely placed COB chips and resistors, will enters a reflow oven. The board passes through several carefully controlled temperature zones.
    Preheat Zone: The board and components are gradually heated. This activates the flux in the solder paste to clean the bonding surfaces and prevents thermal shock.
    Soak Zone: The temperature is stabilized to ensure the entire assembly reaches a uniform temperature, allowing the flux to fully remove oxides from the metal surfaces.
    Reflow Zone: The temperature rapidly rises above the melting point of the solder alloy. The solder paste melts (reflows), becomes liquid, wets the component terminals and PCB pads, and forms a metallurgical bond.
    Cooling Zone: The assembly is cooled in a controlled manner. The solder solidifies, permanently fixing the components in place and forming solid solder joints.
    This process is essential for creating the electrical interconnection between the LED dies and the circuit traces on the FPCB. The quality of the reflow profile directly determines the strength, conductivity, and long-term reliability of the thousands of solder joints on a COB strip.
  • Q Step 5 In-process Test

    A To identify and rectify any defects (such as short circuits, open circuits, or faulty components) that may have occurred during the previous manufacturing steps, ensuring that every COB LED strip meets its specified electrical and functional requirements.

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