A The FPCB, now with the precisely placed COB chips and resistors, will enters a reflow oven. The board passes through several carefully controlled temperature zones.
Preheat Zone: The board and components are gradually heated. This activates the flux in the solder paste to clean the bonding surfaces and prevents thermal shock.
Soak Zone: The temperature is stabilized to ensure the entire assembly reaches a uniform temperature, allowing the flux to fully remove oxides from the metal surfaces.
Reflow Zone: The temperature rapidly rises above the melting point of the solder alloy. The solder paste melts (reflows), becomes liquid, wets the component terminals and PCB pads, and forms a metallurgical bond.
Cooling Zone: The assembly is cooled in a controlled manner. The solder solidifies, permanently fixing the components in place and forming solid solder joints.
This process is essential for creating the electrical interconnection between the LED dies and the circuit traces on the FPCB. The quality of the reflow profile directly determines the strength, conductivity, and long-term reliability of the thousands of solder joints on a COB strip.